Specialty alloys of Indium, Gallium, Cadmium and Gold

AIM is a leading global supplier of indium and indium alloys. Indium is a unique, low-melting ductile metal that will weld under relatively low pressure. Indium wets metallic and non-metallic surfaces. Indium alloys have a wide range of melting points, the lowest being the indium/tin alloy 118 C° eutectic. These alloys are a good choice to solder gold surfaces, where the gold has to remain intact. Indium alloys show excellent fatigue resistance when thermal mis-matches are encouraged. Indium alloys perform very well when operating temperatures do not exceed 120 C°.

AIM SMD Products

AIM Specialty Materials specializes in alloys of Indium, Tin, Lead, Bismuth, Cadmium, Gold and Gallium for a wide range of joining applications.

These materials come in a variety of forms, including preforms, wire, foil & ribbon, seals, pastes, chemicals and compounds.

If you don't see the product you are looking for, please send us your requests.

>> Solders for Photonic Packaging
AIM’s full range of specialty joining materials includes indium and gold/tin solders for photonic packaging applications.

>> Solder Fabrications
AIM’s Specialty solder products are available in a variety of alloys with melting temperatures from 10°C to 400°C. These come in several forms, including preforms, wire, foil & ribbon, and pastes.

>> Indium Seals
AIM supplies indium preforms in various shapes including flat washers, "O" rings, square windows, foil, wire, discs and rectangles.

>> Compounds and Chemicals
AIM is a supplier of Indium compounds and chemicals used in a wide array of industries.

>> Fusible Alloys
Fusible alloys are low melting temperature alloys that contain bismuth, lead, tin, cadmium or indium. AIM’s fusible alloys are utilized in a broad variety of tool & die applications.

>> Sputtering Targets
Sputtering targets are used to produce thin films of metals or compounds.

>> Solder Test Kits
The AIM Solder Test Kit allows you to experiment with a broad range of alloys to find the most suitable solution for your Photonic Packaging assembly process- without having to purchase large quantities of several products.