Indium solder preform shapes of solder alloys

AIM is a leading global supplier of indium and indium alloys. Indium is a unique, low-melting ductile metal that will weld under relatively low pressure. Indium wets metallic and non-metallic surfaces. Indium alloys have a wide range of melting points, the lowest being the indium/tin alloy 118 C° eutectic. These alloys are a good choice to solder gold surfaces, where the gold has to remain intact. Indium alloys show excellent fatigue resistance when thermal mis-matches are encouraged. Indium alloys perform very well when operating temperatures do not exceed 120 C°.

SOLDER FABRICATIONS

AIM’s Specialty solder products are available in a variety of alloys with melting temperatures from 10°C to 400°C. These come in several forms, including:

Preforms
Solder preforms contain precise and predetermined quantities of an alloy or a pure metal. They have been used in a variety of applications, such as hybrid and discrete component assembly and surface mount technology.

AIM solder preforms are manufactured shapes of solder alloys designed to fit a specific joint configuration. Preforms are used in place of traditional solder forms for the assembly and repair of circuit boards. AIM preforms offer several advantages, including a more controlled volume of solder and manufacturing throughput.

AIM solder preforms are made with the same Electropure™ high purity solder and alloys that are used in the manufacturing of AIM solder paste, cored wire and bar solder. A variety of shapes and sizes are available with or without flux coating. AIM preforms are manufactured in specialty alloys, standard tin-lead alloys, and a broad range of lead-free alloys.

Wire
AIM wire solders are produced in diameters ranging from .005" through .500" diameter with many alloys and flux cores to choose from.

AIM wire solders are manufactured in specialty alloys (including pure indium and indium alloy), standard tin-lead alloys, and a broad range of lead-free alloys. We also custom design alloys for unique applications.

Many AIM wire solders are available with no-clean, water soluble, and RMA flux cores. These flux cores promote excellent wetting while allowing for exceptional post-process reliability.

Standard packaging for wire solder is on ½ lb. and 1 lb. spools. However, other spool sizes are available upon request.

Foil/Ribbon
AIM offers high-quality foils in pure metals, specialty alloys (including pure indium and indium alloy), standard tin-lead alloys, and a broad range of lead-free alloys.

Foils are available down to .002" thickness with widths as wide as 6". These are available in many standard alloys and sizes, or we can custom produce these to meet your unique requirements.

Ribbon also is available in pure metals, specialty alloys (including pure indium and indium alloy), standard tin-lead alloys, and a broad range of lead-free alloys. Ribbon is supplied in continuous lengths with widths ranging from .010” to 4”, depending upon the specific alloy being manufactured.

Solder Paste
AIM is one of the world’s largest manufacturers of No-Clean, Water Soluble, and RMA solder pastes designed to meet your most stringent SMT requirements. These pastes are available in a wide variety of packaging, powder size, and solder alloys, including lead-free alloys.

AIM understands the many unique solder paste applications and is able to offer compatible flux chemistries to meet all of these requirements.

Additional information on AIM’s solder pastes may be found by contacting us or by visiting the AIM Electronic Grade Solders website