AIM Specialty Materials

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Photonic Packaging Solders

SOLDERS For PHOTONIC PACKAGING

AIM’s full range of specialty joining materials includes indium and gold/tin solders for photonic packaging applications.  When you work with AIM you receive superior products & the technical support you need to produce innovative and reliable packaging solutions. AIM offers a broad range of solders to fulfill your most challenging component packaging applications.  We offer solders for:

  • Fiber to Ferrule Soldering
  • Laser Die Attach
  • Hermetic Packaging & Sealing
  • Wetting & Sealing Laser Optics
  • Thermal Management
Solder alloys for photonic packaging applications include indium, gold, bismuth, cadmium, and gallium based solder alloys. Please click on any of the above metals to display additional information on their alloys.

The chart below lists a selection of AIM’s most commonly specified solder alloys used in photonic packaging applications.

Alloy Composition Melting Range (°C) Tensile Strength (ksi) Density(g/cm3) CTE(x10-8 / °C)            Creep Resistance

80Au/20Sn

280

276

14.5

16

Excellent

88Au/12Ge

356

185

14.7

13

Excellent

96.5Sn/3.5Ag

221

38

7.36

21

High

95Sn/3.5Ag/1.5In

218

51

7.36

22

High

91Sn/9Zn

199

65

7.27

n/a

Good

63Sn/Pb37

183

32

8.40

25

Moderate

62Sn/Pb36/Ag2

179

46

8.41

27

High

CASTIN

217

40

7.30

40

High

SAC305

218

40

7.40

40

High

40In/60Pb

195-225

34.5

9.31

26

Moderate

70In/30Pb

160-174

23.8

8.19

28

Moderate

80In/Pb15/Ag5

148-149

17.5

7.85

26

Moderate

100In

156.7

2.5

7.31

29

Poor

97In/3Ag

146

5.5

7.38

22

Poor

52In/48Sn

118

11.9

7.30

24

Low

58Bi/42Sn

138

55

8.56

14

Moderate

40Bi/60Sn

138-170

n/a

8.12

14

Moderate

54Sn/26Pb/20In

138-150

n/a

8.10

25

Moderate

35.7Sn/35.7Pb/28.6Bi

100

24

9.34

20

Low

 
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